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Question 1: What defect occurs when solder does not wet the component lead properly?

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Question 2: What is the tolerance limit for lead protrusion after soldering, as per IPC standards?

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Question 3: What is the typical etching chemical used in PCB manufacturing for copper removal?

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Question 4: What is the typical melting point of lead-based solder (Sn60Pb40)?

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Question 5: Which cleaning method is recommended for PCBs with water-soluble flux?

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Question 6: How can you prevent solder paste contamination during assembly operations?

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