Question 1: What defect occurs when solder does not wet the component lead properly?
Which action should you take?
Question 2: What is the tolerance limit for lead protrusion after soldering, as per IPC standards?
Which action should you take?
Question 3: What is the typical etching chemical used in PCB manufacturing for copper removal?
Which action should you take?
Question 4: What is the typical melting point of lead-based solder (Sn60Pb40)?
Which action should you take?
Question 5: Which cleaning method is recommended for PCBs with water-soluble flux?
Which action should you take?
Question 6: How can you prevent solder paste contamination during assembly operations?
Which action should you take?